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Cristina Andersson

Staff

Cristina Andersson

Vice Head for Utilization and Industrial Relations Officer at the Department of Microtechnology and Nanoscience

cristina.andersson@chalmers.se +46317723097 Find me

Publications

Latest publications

2011
Reliability of Microtechnology – Interconnects, Devices and Systems

Author: Johan Liu; Olli Salmela; Jussi Särkkä; James E. Morris; Per-Erik Tegehall; Cristina Andersson

Published: 2011

Published in:

Publication type: Book
2009
Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages

Author: Cristina Andersson; B. Vandevelde; C. Noritake; Peng Sun; Per-Erik Tegehall; Dag R. Andersson; G. Wetter; Johan Liu

Published: 2009

Published in: Soldering and Surface Mount Technology

Publication type: Journal article
Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression

Author: Xiangdong Zou; Yulai Gao; Qijie Zhai; Cristina Andersson; Johan Liu

Published: 2009

Published in: Journal of Electronic Materials

Publication type: Journal article
Design of 50-70 GHz Planar Wideband Bandpass Filter on Liquid Crystal Polymer Substrate

Author: Xia Zhang; Dan Kuylenstierna; Johan Liu; Peng Cai; Cristina Andersson; James E. Morris; Herbert Zirath

Published: 2009

Published in: Journal of Infrared, Millimeter, and Terahertz Waves

Publication type: Journal article
Melting temperature depression of Sn-0.4Co-0.7Cu lead-free solder nanoparticles

Author: C.-D. Zou; Y.-L. Gao; B. Yang; Q.-J. Zhai; Cristina Andersson; Johan Liu

Published: 2009

Published in: Soldering and Surface Mount Technology

Publication type: Journal article
2008
Effect of different temperature cycle profiles on the crack initiation and propagation of Sn3,5Ag wave soldered joints

Author: Cristina Andersson; Dag R. Andersson; Per-Erik Tegehall; Johan Liu

Published: 2008

Published in: Microelectronics Reliability

Publication type: Journal article
Thermal cycling aging effect on the shear strength, microstructure, IMC and initiation and propagation of surface mounted Sn-3.8Ag-0.7Cu and wave soldered Sn-3.5Ag ceramic chip components

Author: Cristina Andersson; Per-Erik Tegehall; Dag R. Andersson; G. Wetter; Johan Liu

Published: 2008

Published in: IEEE Transactions on Components and Packaging Technologies

Publication type: Journal article
Tensile properties and microstructural characterization of Sn-0.7Cu-0.4Co bulk solder alloy for electronics applications

Author: Cristina Andersson; Peng Sun; Johan Liu

Published: 2008

Published in: Journal of Alloys and Compounds

Publication type: Journal article
A Compact V-band Planar Wideband Bandpass Filter Based on Liquid Crystal Polymer Substrates

Author: Xia Zhang; Dan Kuylenstierna; Johan Liu; Peng Cai; Cristina Andersson; James Morris; Herbert Zirath

Published: 2008

Published in: Proceedings of the 2nd Electronics Systemintegration Technology Conference

Publication type: Paper in proceeding
Overview of Carbon Nanotubes as Off-Chip Interconnects

Author: Xia Zhang; Teng Wang; Johan Liu; Cristina Andersson

Published: 2008

Published in: Proceedings of the 2nd Electronics Systemintegration Technology Conference

Publication type: Paper in proceeding
Effect of Corrosion on the Low Cycle Fatigue Behaviour of Sn-4.0Ag-0.5Cu Lead-Free Solder Joints

Author: Cristina Andersson; Johan Liu

Published: 2008

Published in: International Journal of Fatigue

Publication type: Journal article
Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles

Author: Lili Zhang; Wenkai Tao; Johan Liu; Yan Zhang; Zhaonian Cheng; Cristina Andersson; Yulai Gao; Qijie Zhai

Published: 2008

Published in: Proceedings of the 2008 International Conference on Electronics Packaging Technology &　High Density Packaging

Publication type: Paper in proceeding
Recent Advances in the Synthesis of Lead-free Solder Nanoparticle

Author: Cristina Andersson; Changdong Zou; Bin Yang; Yulai Gao; Johan Liu; Qijie Zhai

Published: 2008

Published in: Proceedings of the 2nd Electronics Systemintegration Technology Conference

Publication type: Paper in proceeding
The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn–0.7Cu –0.4Co eutectic solder and ENIG/Cu substrate finish

Author: Lili Zhang; Cristina Andersson; Johan Liu; Zhaonian Cheng

Published: 2008

Published in: Proceedings of the 2nd Electronics Systemintegration Technology Conference

Publication type: Paper in proceeding
Development of Nanomaterials and Devices for Electronics Cooling and Interconnect

Author: Johan Liu; Teng Wang; Björn Carlberg; Wanbing Guan; Martin Jönsson; Cristina Andersson; Yulai Gao; Qijie Zhai; Eleanor E.B. Campbell

Published: 2008

Published in: Proceedings of the Ecology in Electronics Conference in “Progress in Eco-Electronics”, as Monongraphies of Tele, Radio Institute

Publication type: Book chapter
Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression

Author: Xiangdong Zou; Yulai Gao; Qijie Zhai; Cristina Andersson; Johan Liu

Published: 2008

Published in: Journal of Electronics Materials

Publication type: Journal article
Recent Development of Nano-solder Paste for Electronics Interconnect Applications

Author: Johan Liu; Cristina Andersson; Yulai Gao; Qijie Zhai

Published: 2008

Published in: Proceedings of the IEEE 10th Electronics Packaging Technology Conference

Publication type: Paper in proceeding
2007
Reliability, fatigue and mechanical characterization of lead-free solders for electronic packaging applications

Author: Cristina Andersson

Published: 2007

Published in:

Publication type: Doctoral thesis
Effect of different temperature cycling profiles on the crack initiation and propagation and of Sn-3.5Ag wave soldered joints

Author: Cristina Andersson; Dag R. Andersson; Per-Erik Tegehall; Johan Liu

Published: 2007

Published in: Microelectronics and Reliability

Publication type: Journal article
Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

Author: Sun Peng; Cristina Andersson; Johan Liu

Published: 2007

Published in: Journal of Alloys and Compounds

Publication type: Journal article
Effect of Corrosion on the Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-Free Solder Joints

Author: Cristina Andersson; Johan Liu

Published: 2007

Published in: International Journal of Fatigue

Publication type: Journal article
2006
Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-free in Corrosive Environmental Conditions

Author: Cristina Andersson

Published: 2006

Published in: Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany

Publication type: Paper in proceeding
Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering

Author: Peng Sun; Cristina Andersson; Xicheng Wei; Zhaonian Cheng; Dongkai Shangguan; Johan Liu

Published: 2006

Published in: Materials Science & Engineering B: Solid-State Materials for Advanced Technology

Publication type: Journal article
Evolution of intermetallic compounds in PBGA Sn-Ag-Cu solder joints during thermal ccling testing

Author: Peng Sun; Cristina Andersson; Johan Liu; Dag R Andersson; Per-Erik Tegehall; Dongkai Shangguan

Published: 2006

Published in: Proceedings of the 2006 7th International Conference on Electronics Packaging Technology

Publication type: Paper in proceeding
Characterization of Nanoparticles of Lead Free Solder Alloys

Author: Wanbing Guan; Suresh Chand Verma; Yulai Gao; Cristina Andersson; Qijie Zhai; Johan Liu

Published: 2006

Published in: Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006)

Publication type: Paper in proceeding

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Page manager Published: Tue 24 Oct 2017.