
Welcome to the workshop Heterogeneous Integration.
Overview
Date:
Starts 22 June 2026, 12:00Ends 24 June 2026, 13:00Location:
Language:
EnglishLast sign up date:
20 April 2026
Silicon photonics has democratized access to photonic circuits, yet it alone cannot address the diverse needs in high-speed telecommunications, quantum computing, precision metrology, etc. Heterogeneous photonic integration -- combining the laser and photodetection efficiency of III-V materials, the high-speed modulation of lithium niobate, the low-loss of silicon nitride, and the CMOS compatibility of silicon onto a single chip - has emerged as an excellent solution.
This workshop brings together experts in this field to share expertise and insights, discuss recent progress, and explore future directions. Topics span the full spectrum from wafer bonding, transfer-printing and epitaxial growth to advanced packaging and foundry-level manufacturing. We are excited to welcome everyone in the community to a gathering of heterogeneous photonic integration.
Organisers:
Kaiyi Wu, Chalmers University of Technology
Victor Torres Company, Chalmers University of Technology
Bart Kuyken, Ghent University
- Postdoc, Photonics, Microtechnology and Nanoscience
- Full Professor, Photonics, Microtechnology and Nanoscience
