Thermal management of hot spots with localized high heat flux is critical for high power electronic devices. Non-uniform heat dissipation leads to the overheating of specific areas in chips, affecting the computing performance and reliability of these devices. Active solutions like thermoelectrics, enable site-specific and on demand cooling in electronic devices. For passive solutions, a heat spreader without power consumption is widely used. Metallic materials such as Cu and Al, are utilized to dissipate heat from the hot spots due to their high thermal conductivity. While, due to the scattering of electrons from the film surfaces, the thermal conductivity of metal film decreases with decreasing of the film thickness.
In this project, we plan to develop a graphene-carbon nanotube (G-CNT) hybrid material based heat spreader which will facilitate the heat spreading on high power density devices. This novel heat spreader combines the high thermal performance of both graphene and CNTs. In addition, the CNTs act as rebar in the hybrid therefore will greatly improve the mechanical strength of the hybrid material. This project will focus on experiment work. The work will be performed in the MC2 cleanroom and the EMSL lab. Various equipments will be applied for the characterization of the new heat spreader, this includes SEM, TEM, Raman, infrared camera etc.
Students with a background in material, electronics, nanotechnology, physics or equivalent is preferred. Experience in cleanroom work is a plus.References
1. Gao Z. et al., Thermal CVD grown graphene heat spreader for thermal management of hot spots. Carbon, 2013.
2. Zhang Y. et al., Improved heat spreading performance of functionalized graphene in microelectronic device application. Advanced Functional materials, 2015.For more information: Please contact supervisor: Assistant Professor Yifeng Fu, 031-772 3093, firstname.lastname@example.org