Thermal management is responsible for the heat dissipation from electronics systems to ambient environment and the reliability and lifetime of microsystems are greatly dependent on how they are cooled down. As electronic components are continuously miniaturized and the integration density in microsystems is becoming higher and higher, thermal management in electronics becomes a very big challenge.
Thermal interface materials (TIMs), which facilitate heat transfer across contact interfaces, play a critical role in thermal management. Due to their excellent thermal performance, graphene and carbon nanotubes (CNTs) have been proposed for TIM application. In our group we have developed a graphene-CNT hybrid based TIM by combining their outstanding thermal properties. Systematic characterizations are planned in this project, including thermal, electrical, mechanical and structural characterizations of the new TIM.
This project will focus on experiment work. The work will be performed in the MC2 cleanroom and the EMSL lab. Various equipment will be applied for the characterization of the new TIM, this includes SEM, TEM, Raman, shear tester, PPR measurement, etc.
Students with a background in material, electronics, nanotechnology, physics or equivalent is preferred. Experience in cleanroom work is a plus.References
1. Zhu Y. et al., A seamless three dimensional carbon nanotube graphene hybrid material, Nature Comm., 2012.
2. Geim A. & Novoselov K., The rise of graphene, Nature Materials, 2007.For more information, please contact supervisor: Assistant Professor Yifeng Fu, 031-772 3093, firstname.lastname@example.org