Thermal Effects (THERMAL)

​Motivation
The trend for both mobile communication systems and microwave sensors is the use of more transceivers as well as higher level of integration of these. The heating elements (mainly power amplifiers) will hence increase in number and be more densely packed. The available area for heat sinks will at the same time be reduced due to the move to higher operating frequencies. Furthermore, the higher level of integration will lead to multiple amplifiers on the same die, resulting strong thermal coupling between different transceivers, which needs to be accounted for. It can therefore be foreseen that the electronics in these systems will operate at higher temperatures compared to less integrated systems; hence reliability will be an important issue.

Objectives
  • Electro-thermal effects at transistor/die level
  • Electro-thermal characterization with electrical and thermal stimuli
  • CAD and TCAD transistor modelling
  • Integration of heat spreaders and/or heat sinks
  • Thermal effect compensation
  • Thermal effects in multi antenna systems
  • Dynamic thermal coupling between transceiver blocks
  • Reliability
  • Long term reliability of electronics in multi antenna systems in harsh environments
  • Fault analysis on transistor level
Project outcome
  • 2 new PhDs
  • 20 articles in high impact journals or major peer reviewed conferences
  • 50 % of the articles co-authored with industrial partners
  • 1 test-bed for electro-thermal characterization enabling both electrical and thermal stimuli
Research partners
Chalmers, Ericsson, Keysight Technologies​Infineon, Saab, UMS

Project Leader
Mattias Thorsell, Chalmers

Published: Fri 21 Dec 2018.