Kjell Jeppson

Professor emeritus at the Department of Microtechnology and Nanoscience, Terahertz and Millimete Wave Laboratory

kjell.jeppson@chalmers.se +46 31 772 18 56 Find me http://orcid.org/0000-0001-5049-9303

Involved in research concerning aspects of application specific integrated circuit (ASIC) design, 3D integration and signal integrity, growth of carbon nanotubes for through-silicon-vias, transistor modelling and parameter extraction.

Technical Program Committee Member of the following conferences
Norchip - the annual Nordic ASIC Event
ICMTS - the International Conference on Microelectronic Test Structures
EWME - The European Workshop on Microelectronics Education

Publications
Collaboration and projects

Latest publications

2019
Thermal Characterization of Low-Dimensional Materials by Resistance Thermometers

Author: Yifeng Fu; G Cui; Kjell Jeppson

Published: 2019

Published in: Materials

Publication type: Review article
2018
Low-frequency Noise Characterization of Graphene FET THz Detectors

Author: Xinxin Yang; Andrei Vorobiev; Kjell Jeppson; Jan Stake; Luca Banszerus; Christoph Stampfer; Martin Otto; Daniel Neumaier

Published: 2018

Published in:

Publication type: Paper in proceedings
Improving Thermal Transport at Carbon Hybrid Interfaces by Covalent Bonds

Author: Majid Kabiri Samani; Shuangxi Sun; Yifeng Fu; T Xu; Ye Lilei; Maulik Satwara; Kjell Jeppson; Torbjörn Nilsson; L Sun; Johan Liu

Published: 2018

Published in: Advanced Materials Interfaces

Publication type: Journal article
Test structures for evaluating Al2O3 dielectrics for graphene field effect transistors on flexible substrates

Author: Xinxin Yang; Marlene Bonmann; Andrei Vorobiev; Kjell Jeppson; Jan Stake

Published: 2018

Published in:

Publication type: Paper in proceedings
2017
Test structures for studying flexible interconnect supported by carbon nanotube scaffolds

Author: Kjell Jeppson; Di Jiang; Shuangxi Sun; Michael Edwards

Published: 2017

Published in:

Publication type: Paper in proceedings
A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds

Author: Di Jiang; Shuangxi Sun; Michael Edwards; Kjell Jeppson; Nan Wang; Yifeng Fu; Johan Liu

Published: 2017

Published in:

Publication type: Journal article
Chemical vapor deposition grown graphene on Cu-Pt alloys

Author: Yong Zhang; Yifeng Fu; Michael Edwards; Kjell Jeppson; Lilei Ye; Johan Liu

Published: 2017

Published in: Materials Letters

Publication type: Journal article
2016
2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS

Author: Yong Zhang; S. Huang; Nan Wang; Jie Bao; Shuangxi Sun; Michael Edwards; Yifeng Fu; Kjell Jeppson; Johan Liu; et al.

Published: 2016

Published in:

Publication type: Conference contribution
Controllable and fast synthesis of bilayer graphene by chemical vapor deposition on copper foil using a cold wall reactor

Author: Wei Mu; Yifeng Fu; Shuangxi Sun; Michael Edwards; Lilei Ye; Kjell Jeppson; Johan Liu

Published: 2016

Published in: Chemical Engineering Journal

Publication type: Journal article
Finite element simulation of 2D-based materials as heat spreaders

Author: Michael Edwards; Yong Zhang; Jie Bao; Majid Kabiri Samani; Kjell Jeppson; Johan Liu

Published: 2016

Published in:

Publication type: Paper in proceedings
The Effects of Graphene-Based Films as Heat Spreaders for Thermal Management in Electronic Packaging

Author: Shirong Huang; Jie Bao; N. Wang; G. Yuan; Wei Ke; Dongsheng Zhang; Wang Yue; Yifeng Fu; Lilei Ye; Kjell Jeppson; Johan Liu

Published: 2016

Published in:

Publication type: Paper in proceedings
Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders

Author: Kjell Jeppson; Jie Bao; S. Huang; Yong Zhang; Shuangxi Sun; Yifeng Fu; Johan Liu

Published: 2016

Published in:

Publication type: Paper in proceedings
Double-Densified VerticallyAligned Carbon Nanotube Bundles for Application in 3D Integration High Aspect Ratio TSV Interconnects

Author: Wei Mu; Josef Hansson; Shuangxi Sun; Michael Edwards; Yifeng Fu; Kjell Jeppson; Johan Liu

Published: 2016

Published in:

Publication type: Paper in proceedings
Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging

Author: Jie Bao; Michael Edwards; Shirong Huang; Yong Zhang; Yifeng Fu; et al; Kjell Jeppson; Johan Liu

Published: 2016

Published in: Journal of Physics D: Applied Physics

Publication type: Journal article
Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects

Author: Shuangxi Sun; Wei Mu; Michael Edwards; Davide Mencarelli; Luca Pierantoni; Yifeng Fu; Kjell Jeppson; Johan Liu

Published: 2016

Published in: Nanotechnology

Publication type: Journal article
Enhanced Cold Wall CVD Reactor Growth of Horizontally Aligned Single-walled Carbon Nanotubes

Author: Wei Mu; Eun-Hye Kwak; Bingan Chen; Shirong Huang; Michael Edwards; Yifeng Fu; Kjell Jeppson; Kenneth Teo; Goo-Hwan Jeong; Johan Liu

Published: 2016

Published in: Electronic Materials Letters

Publication type: Journal article
Infrared Emissivity Measurement for Vertically Aligned Multiwall Carbon Nanotubes (CNTs) Based Heat Spreader Applied in High Power Electronics Packaging

Author: Shirong Huang; N. Wang; Jie Bao; Hui Ye; Dongsheng Zhang; Wang Yue; Yifeng Fu; Lilei Ye; Kjell Jeppson; Johan Liu

Published: 2016

Published in:

Publication type: Paper in proceedings
Embedded Fin-Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors

Author: Di Jiang; Nan Wang; Michael Edwards; Wei Mu; ANDREAS NYLANDER; Yifeng Fu; Kjell Jeppson; Johan Liu

Published: 2016

Published in: Small

Publication type: Journal article
Preventing Aging of Electrically Conductive Adhesives on Metal Substrate Using Graphene-Based Barrier

Author: Hui Ye; Shirong Huang; Kjell Jeppson; Lilei Ye; Johan Liu

Published: 2016

Published in:

Publication type: Conference contribution
Large area and uniform monolayer graphene CVD growth on oxidized copper in a cold wall reactor

Author: Wei Mu; Yifeng Fu; Shuangxi Sun; Michael Edwards; Lilei Ye; Kjell Jeppson; Johan Liu

Published: 2016

Published in:

Publication type: Paper in proceedings
Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications

Author: Yong Zhang; Michael Edwards; Kabir Majid Samani; Nikolaos Logothetis; Lilei Ye; Yifeng Fu; Kjell Jeppson; Johan Liu

Published: 2016

Published in: Carbon

Publication type: Journal article
Synthesis and Applications of Two-Dimensional Hexagonal Boron Nitride in Electronics Manufacturing

Author: Jie Bao; Kjell Jeppson; Michael Edwards; Yifeng Fu; Lilei Ye; Xiuzhen Lu; Johan Liu

Published: 2016

Published in: Electronic Materials Letters

Publication type: Journal article
2015
Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications

Author: Wei Mu; Shuangxi Sun; Di Jiang; Yifeng Fu; Michael Edwards; Yong Zhang; Kjell Jeppson; Johan Liu

Published: 2015

Published in: Journal of Electronic Materials

Publication type: Journal article
Vertically stacked carbon nanotube-based interconnects for through silicon via application

Author: Di Jiang; Wei Mu; Si Chen; Yifeng Fu; Kjell Jeppson; Johan Liu

Published: 2015

Published in: IEEE Electron Device Letters

Publication type: Journal article
Improved Heat Spreading Performance of Functionalized Graphene in Microelectronic Device Application

Author: Yong Zhang; H. X. Han; Nan Wang; Pengtu Zhang; Y. F. Fu; Murali Murugesan; Michael Edwards; Kjell Jeppson; S. Volz; Johan Liu

Published: 2015

Published in: Advanced Functional Materials

Publication type: Journal article

Go to Chalmers publication library

Projects
CNT as TSV for 3D Integration

The feasibility of using carbon nanotube (CNT) bundles as the fillers of through silicon vias (TSVs) has been demonstrated. CNT bundles are synthesized directly inside TSVs by thermal...
Closed
1/1/2010 — 12/31/2013

Thermal management with carbon nanotube architectures (THEMA-CNT)

Published: Tue 09 Oct 2012. Modified: Thu 23 Mar 2017

Kjell Jeppson

Latest publications

2019

2018

2017

2016

2015

Projects

Closed