The TESCAN GAIA3 integrates a field emission SEM with a FIB. The SEM unit is equipped with detectors for secondary and backscattered electron imaging. The ion column uses a Ga liquid ion metal source (LMIS) and a set of electrostatic lenses for bombarding the target material with a focused ion-beam for material removal or deposition. The instrument is also equipped with a Gas Injection System (GIS) for deposition of Pt, XeF2, carbon, water and also an Omniprobe for TEM thin foil extraction. The GAIA3 has a low vacuum mode, however FIB imaging and milling is only permitted in the high vacuum mode.
The GAIA3 is equipped with an Oxford X-Max 80 mm2 detector for EDX analysis and a NordlysNano Camera for EBSD analysis. Combined with a sequential cutting and recording procedure this allows for simultaneous 3D EDX and EBSD mapping of a sample.
A Leica VCT500 cryo set facilitates transfer of cryo cooled samples to the GAIA for cryo in situ TEM specimen preparation.
Kleindiek micromanipulators are also available supporting electrical and force measurements
- Ga ion source
- Operating voltage: 0.5 kV to 30 kV
- Currents: 1 pA to 60 nA
- Field emission gun
- Operating voltages: 500 V (20 V with beam deceleration) to 30 kV
- Resolution: 0.7 nm at 15kV