In this research area, we study graphene as heat dissipation material for electronics cooling. The graphene is made via thermal CVD and chemical and mechanical exfoliation. The effect of hot spot size, the passivation layer thickness (SiO2) and number of graphene layers on the thermal performance are studied. Structural characterization tools include Raman spectroscopy and TEM while thermal characterization are carried out using analysis tools based on transient Laser-flash diffusivity, Raman thermometry and steady state ASTM methods.
CNRS, and Thales Research, France, ICN, Spain, HKUST, Shanghai University and SHT Smart High Tech AB
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Online info: http://dx.doi.org/10.1016/j.carbon.2013.05.014